SCU:0TS1640
Weight: 95 g
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
NAND Flash Memory Type: 3D triple-level cell (TLC)
Capacity: 6400 GB
  • Изчерпан
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Цена за доставка: 4.99 лв с ДДС
Безплатна доставка при поръчка над 99 лв с ДДС
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Изчерпан

Weight: 95 g
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
NAND Flash Memory Type: 3D triple-level cell (TLC)
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
Device Type: Solid state drive - internal
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Max Storage Temperature: 70 °C
Min Storage Temperature: -40 °C
Max Operating Temperature: 78 °C
Min Operating Temperature: 0 °C
Service & Support: Limited warranty - 5 years
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Non-Recoverable Errors: 1 per 10^17
MTBF: 2,000,000 hours
Average Latency: 239 μs
Maximum 4KB Random Read: 306520 IOPS
Maximum 4KB Random Write: 88210 IOPS
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Drive Writes Per Day (DWPD): 2
Weight: 95 g
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Interface: U.2 PCIe 3.1 x4 (NVMe)
Form Factor: 2.5"
NAND Flash Memory Type: 3D triple-level cell (TLC)
Encryption Algorithm: 256-bit AES
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Drive Writes Per Day (DWPD): 2
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Manufacturer: HGST
Max Storage Temperature: 70 °C
Min Storage Temperature: -40 °C
Max Operating Temperature: 78 °C
Min Operating Temperature: 0 °C
Service & Support: Limited warranty - 5 years
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Compatible Bay: 2.5"
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Average Latency: 239 μs
Maximum 4KB Random Read: 306520 IOPS
Maximum 4KB Random Write: 88210 IOPS
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Drive Writes Per Day (DWPD): 2
Weight: 95 g
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Interface: U.2 PCIe 3.1 x4 (NVMe)
Form Factor: 2.5"
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Capacity: 6400 GB
Device Type: Solid state drive - internal
Manufacturer Part No: 0TS1640
Manufacturer: HGST
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Capacity: 6400 GB
Device Type: Solid state drive - internal
Manufacturer Part No: 0TS1640
Manufacturer: HGST
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Maximum 4KB Random Write: 88210 IOPS
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Drive Writes Per Day (DWPD): 2
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Max Storage Temperature: 70 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Min Operating Temperature: 0 °C
Service & Support: Limited warranty - 5 years
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Non-Recoverable Errors: 1 per 10^17
Average Latency: 239 μs
MTBF: 2,000,000 hours
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Form Factor: 2.5"
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Manufacturer: HGST
Manufacturer Part No: 0TS1640
Device Type: Solid state drive - internal
Capacity: 6400 GB
Encryption Algorithm: 256-bit AES
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: 2.5"
Interface: U.2 PCIe 3.1 x4 (NVMe)
Features: Instant Secure Erase (ISE), 64-layer 3D BiCS FLASH, NVM Express (NVMe) 1.3
Weight: 95 g
Drive Writes Per Day (DWPD): 2
Internal Data Rate: 2540 MBps (read) / 1240 MBps (write)
Maximum 4KB Random Write: 88210 IOPS
Maximum 4KB Random Read: 306520 IOPS
Average Latency: 239 μs
MTBF: 2,000,000 hours
Non-Recoverable Errors: 1 per 10^17
Interfaces: 1 x PCI Express 3.1 x4 (NVMe)
Compatible Bay: 2.5"
Power Consumption: 10.75 Watt (average)
6.1 Watt (idle)
Service & Support: Limited warranty - 5 years
Min Operating Temperature: 0 °C
Max Operating Temperature: 78 °C
Min Storage Temperature: -40 °C
Max Storage Temperature: 70 °C
Гаранция: 60 месеца

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